天津职业技术师范大学学报

为解决微芯片封装注塑成型过程中出现的金线偏移缺陷问题，以汽车电子芯片为对象，利用Moldflow2018仿真软件进行数值模拟，研究了不同工艺参数对金线偏移量的影响并通过优化获得最佳参数组合。通过单因素实验依次分析模具温度、保压压力及注射时间对最大剪切速率、最大剪切应力与金线偏移量3个指标的影响，揭示三者之间的相互作用关系。采用Box-Behnken设计及响应面分析法，对影响金线偏移量的3个工艺参数进行优化，以获得最小金线偏移量。结果表明：优化后的最佳参数组合为模具温度170℃、保压压力14.99 MPa、注射时间13 s；响应面模型预测结果与实验结果的相对误差仅为0.327%，说明该模型对最小金线偏移量具有良好的预测能力，能够为金线偏移量工艺参数的优化提供依据。

To address gold-wire sweep defects during the injection molding of microchip packages, this study takes an automotive electronic chip as the object and uses Moldflow 2018 simulation software to conduct numerical simulations. The effects of different process parameters on gold-wire sweep are examined, and the optimal parameter combination is obtained through optimization. Single-factor experiments are used to analyze the effects of mold temperature, packing pressure, and injection time on maximum shear rate, maximum shear stress, and gold-wire sweep, revealing the interactions among these three indicators. The Box-Behnken design and response surface methodology are then applied to optimize the three process parameters affecting gold-wire sweep so as to minimize its value. The results show that the optimal parameter combination is a mold temperature of 170 ℃, a packing pressure of 14.99 MPa, and an injection time of 13 s. The relative error between the response surface model prediction and the experimental result is only 0.327%, indicating that the model has good predictive capability for minimum gold-wire sweep and can provide a basis for optimizing process parameters.