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介绍了当前超大规模集成电路技术的发展现状及几种主要生产工艺,如化学机械抛光、离子注入、物理气相沉积、化学气相沉积、刻蚀等,并对今后使ULSI特征尺寸从0.13μm进一步减小的研究方向以及材料的选择等方面进行了探讨。
Abstract：ULSI technology status and major production processes, such as chemical mechanical polishing, ion implantation, physical vapor deposition, chemical vapor deposition, etch and etc., are introduced in this paper. As the device feature size further shrinking continuously from 0.13 μm, the research trends, materials selection and the preparation of related engineers and scientists are also discussed.
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基本信息:
DOI：
中图分类号:TN40
引用信息:
[1]李兴,刘盾,张建民.现代微电子技术及其发展综述[J].天津职业技术师范学院学报,2003(04):35-37+46.
基金信息:
教育部科学技术研究重点项目(02012)